Sale! Dow Corning TC-5688 Thermally Conductive Compound was developed exclusively for Intel microprocessors in collaboration with the Intel Mobile Platforms Group. TC-5688 was developed and optimized for multi-chip packages and employs a proprietary formula of a
Unconditional Satisfaction GuaranteeNo Shipping Fees Above 302 Months to Decide. Returns Simplified.Dow Corning TC-5688 Thermally Conductive Compound was developed exclusively for Intel microprocessors in collaboration with the Intel Mobile Platforms Group. TC-5688 was developed and optimized for multi-chip packages and employs a proprietary formula of advanced silicone polymers that interacts with thermally conductive filler particles to form a matrix that is highly resistant to pump-out and other common failure mechanisms. The result is a thermal compound that delivers extreme performance and exceptional reliability for the thermal interface needs.
Note: This Item can not be shipped using DHL
Cost - $25
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Delivery Time It usually takes [3-5] business days for standard shipping. Please note that this is an estimated time frame and may be affected by local holidays, and unforeseen circumstances.
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